TDK
TDK Product Features
The level of cleanliness required for manufacturing processes such as semiconductor facilities and flip chip mounters is ever rising. TDK obtained the particle score which was the world's best ever recorded level in a PWP test. We manufacture and sell the next generation mini-environment systems equipped with the FOUP load port compatible with every company's 300-mm FOUP with no adjustment, enabled by the air cushion system, as well as with an automatic nitrogen purge. In addition, we manufacture and sell flip chip mounting systems which are highly reliable, space saving, and economically priced. TDK, the supplier of electronic components, brings these systems to you after thoroughly evaluating the needs at production sites from the user's perspective.
FOUP Load Port TAS300
1. The highest degree of cleanness ever achieved in the industry
The number of microscopic particles reduced to the absolute minimum.
The world’s highest ever recorded level in a PWP test
- Designed to keep a unit thoroughly clean -the wiring and piping do not come into contact whilst the equipment is in operation.
- TDK’s unique precision control air flow
2. High compatibility – compatible with the FOUP of every company
A unique mechanism, highly adaptable to the smallest difference in each FOUP, prevents any impact between the FOUP and the load port; secure and reliable latch key insertion gives high compatibility.
- Air cushion system: ensures secure and reliable attachment and removal, opening and closing with the FOUP of each company.
- Introduction result: world share No.1*
3. Improvements to maintenance
Designed for easy maintenance: maintenance in the minimum of time; the unit can without difficulty be quickly customized for any semiconductor production line.
- 50% time saving over earlier version: installation time into semiconductor manufacturing equipment and time for regular maintenance, including parts replacement slashed by more than half.
4. High reliability and high durability
TDK’s factory automation technology ensures excellent reliability, stability and durability.
- A highly reliable design; outstanding results in reliability tests, decrease in the number of drive shafts.
- MCBF* 500,000 times achieved
*MCBF – Mean Cycle Between Failure: the number of operations of a piece of equipment from the start of use or after repair of a malfunction, until the next equipment failure
Flip-chip Mounting System
Debut of Flip Chip Bonding system that meets the needs of your production.
TDK, an electronic supplier, has completely evaluated the production to find the needs of users and produced this high-reliable, space-saving, high-speed equipment for your specific needs.
High Precision Bonder AFM-15
- Excellent mounting tact time 0.75sec/chip（including 0.2sec process time）
- Excellent mounting accuracy（±7μm/3σ）
- Smallest Footprint（0.99m2）
- Low energy connection
- 12inch wafer capability
High Precision Dispenser MDM-50
- Continuous stable amount of dispense
- Excellent dispense nozzle positioning accuracy（±3μm）
- Smallest footprint（0.84m2）
- Dispense monitoring system for traceability control
CONTACT
Please feel free to contact us with any questions
(+66) 2-752-6425-6
