Test Research, Inc (TRI)

The TR7007Q SII is a cutting-edge 3D SPI system designed to enhance your production processes. With its high-speed platform, the 3D SPI delivers up to 50% faster inspection compared to previous models, ensuring optimal efficiency. Experience improved accuracy and stability, allowing for precise solder measurements and minimizing false calls. Equipped with a wide spectrum light system and coaxial lighting*, the TR7007Q SII enhances contrast and detection rates, enabling you to capture intricate details with exceptional clarity. The 3D SPI is an Industry 4.0 Ready Solution supporting the upcoming and innovative protocols such as IPC Connected Factory Exchange (CFX) and IPC Hermes 9852 standard. (*Optional)

The TR7007D/DI Plus 3D SPI platform is equipped with an improved motion controller (EtherCAT) and an enhanced 2D lighting module. The TR7007D/DI Plus can accurately inspect low solder bridges and compensate board warpage for eliminating local PCB deformation. The TR7007D/DI Plus is equipped with two projectors to ensure seamless shadow-free inspection. The SPI solution eases data exchange between the production line and the MES of your choice to enable data traceability for the connected factory.

Built around the successful and reliable TR518 series platform, the TR518 SII MDA now provides its excellent performance combined with friendly Windows 10 user interface design and USB interface connection to test PC or notebook. With up to 2560 analog test points, TestJet technology and many other features, the TR518 SII delivers high speed, high accuracy and high reliability testing.